Any Layer Interconnection 

This HDI PCB utilizes any layer interconnection capability, enabling direct connections between all layers. This supports highly complex and compact circuit designs essential for advanced electronics, maximizing functionality within minimal space.

Laser Micro Vias: 0.1mm

Featuring laser-drilled micro vias as small as 0.1mm in diameter, the board ensures superior signal integrity and high-density routing. This precision supports faster signal transmission and greater component density for high-performance applications.

Via-in-Pad Technology

Via-in-pad technology is integrated to place vias directly in surface mount pads, enhancing electrical performance and thermal management. This design minimizes signal path length and improves reliability in high-frequency and high-power circuits.

Conductive Filling Technology

Advanced conductive filling technology is employed to fill micro vias and through-holes, ensuring robust electrical connectivity and mechanical stability. This process enhances thermal endurance and prevents solder wicking during assembly.

2+NL+2 Stackup Structure

The PCB features a 2+NL+2 stackup configuration, combining core and buildup layers for optimal electrical and mechanical performance. This structure supports high-speed signaling and efficient power distribution in compact designs.

Ultra-Fine Tracing: 0.075mm

With ultra-fine tracing capabilities down to 0.075mm line width, the board enables intricate circuitry and high component density. This precision supports advanced applications requiring minimal signal loss and maximum layout efficiency.