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Optical Module HDI PCB

Optical Module HDI PCB

Product Model: Optical Module HDI PCB
Layer Count: 8-Layer Stack-up
Base Material: FR-4, Tg170
Board Construction: 2+4+2 HDI (High-Density Interconnect) Buildup
Final Board Thickness: 0.8 mm
Finished Copper Weight: 0.5 oz
Solder Mask Color: Green / White
Surface Finish: Electrolytic Hard Gold Plating
Special Feature: Beveled Gold Fingers (Edge Connector)
Minimum Trace / Space: 3 mil / 3 mil
Primary Application: Optical Communication Module

Halogen-Free PCB

Halogen-Free PCB

Model Number: Display Backplane Halogen-Free PCB
Base Material: S1150G
Layer Count: 10 Layers
Solder Mask Color: Green/White
Final Board Thickness: 0.8mm
Finished Copper Weight: 0.5 oz
Surface Finish: Electroless Nickel Immersion Gold (ENIG)
Minimum Trace Width: 3 mil (0.075 mm)
Minimum Spacing: 3 mil (0.075 mm)
Key Characteristic: Halogen-Free Compliant (HF PCB)
Primary Application: Halogen-Free Display Backplane PCB

Low Temperature Co-fired Ceramic (LTCC) PCB – Key Specifications

Low Temperature Co-fired Ceramic (LTCC) PCB – Key Specifications

Maximum substrate size: 100 mm × 100 mm
Minimum line width / spacing: 0.075 mm / 0.15 mm
Conductor thickness (printed): 10–25 μm
Printing line width accuracy: ±10 μm
Stack alignment accuracy: ≤30 μm
Minimum through-hole diameter: 0.1 mm
Sintering shrinkage accuracy: ±0.2%
Minimum conductor-to-edge clearance: 0.2 mm
Minimum via-to-line distance: 0.15 mm
Minimum resistor/conductor overlap: 0.15 mm
Minimum resistor dimensions: 0.15 mm × 0.15 mm
Maximum number of dielectric layers: 40 layers

High-Density Interconnect (HDI) Printed Circuit Board

High-Density Interconnect (HDI) Printed Circuit Board

Product Model: HDI PCB
Layer Count: 4 to 48 layers
Laminate Materials: Shengyi, Tuc, ITEQ, Panasonic
Board Construction: 1-5 sequential lamination builds or any-layer HDI technology
Finished Board Thickness: 0.3mm to 3.2mm
Copper Weight (Finished): 0.5 oz/ft² or 1.0 oz/ft²
Solder Mask Color: Green, White, Black, Red, Blue
Surface Finish: Electroless Nickel Immersion Gold (ENIG) or Organic Solderability Preservative (OSP)
Specialized Technology: Controlled gold thickness (ENIG)
Minimum Trace/Space: 2 mil / 2 mil (specifically for BGA areas)
Application: High-density interconnect circuit boards

Mobile Phone Any-layer HDI PCB

Mobile Phone Any-layer HDI PCB

Product Category: High-Density Interconnect (HDI) Printed Circuit Board
Application: Android Mobile Phone
Model Designation: Android Mobile Phone Any-layer HDI PCB
Layer Count: 12 Layers
Base Material: TUC TU883
Construction Type: Any-layer HDI Build-up
Final Board Thickness: 1.2 mm
Copper Weight (Finished): 0.5 oz
Solder Mask Color: Blue and White
Surface Finish: ENIG (Electroless Nickel Immersion Gold) + OSP (Organic Solderability Preservative)
Special Technologies: None Applied
Minimum Line Width / Spacing: 3 mil / 3 mil

Smartphone Mainboard PCB

Smartphone Mainboard PCB

Layer Count: 12 layers
Base Material: IT180A TG170 FR4
Board Construction: 3+6+3 HDI (High-Density Interconnect) structure
Finished Thickness: 1.0 mm
Copper Weight: 0.5 oz
Solder Mask Color: Blue/White
Surface Finish: Immersion Gold (ENIG)
Minimum Trace/Space: 2.5 mil / 2.5 mil
Application: Smartphone mainboard circuitry

HDI 10-Layer Mouse Bite PCB

HDI 10-Layer Mouse Bite PCB

Product Type: High-Density Interconnect (HDI) Printed Circuit Board with Mouse Bite Features
Model Designation: HDI Mouse Bite PCB
Layer Count: 10 Layers
Base Material: SY S1000-2
Stack-up Configuration: 1+4+HDI Build-up
Overall Thickness: 0.8 mm
Copper Weight (Inner/Outer): 1 oz per layer
Solder Mask: Green over White Silkscreen
Surface Finish: Electroless Nickel Immersion Gold (ENIG)
Minimum Trace/Space Width: 3 mil / 3 mil
Target Application: Consumer Electronics HDI PCB Board

HDI PCB Mobile Phone

HDI PCB Mobile Phone

Layer Count: 60 Layers
Laminate Material: Sys1000-2 (High-Frequency/Custom Laminate)
Build-Up Construction: 1 + 4 + 1, 1st Order HDI
Final Thickness: 0.8 mm
Finished Copper Weight: 0.5 oz

6-Layer 1+N+1 Mobile Phone PCB

6-Layer 1+N+1 Mobile Phone PCB

Product Model: 6-Layer 1+N+1 Mobile Phone PCB
Base Material: High-Tg Material S1000-2
Layer Construction: 6-Layer, 1+N+1 Stack-up
Solder Mask Color: Green / White
Finished Board Thickness: 0.8 mm
Copper Weight: Inner Layers: 0.5 oz, Outer Layers: 1 oz
Surface Finish: ENIG (Electroless Nickel Immersion Gold) + OSP (Organic Solderability Preservative)
Minimum Line Width / Spacing: 3 mil / 3 mil
Primary Application: High-Density Interconnect (HDI) Mobile Phone PCB

High-Density Interconnect (HDI) Printed Circuit Board

High-Density Interconnect (HDI) Printed Circuit Board

Layer Count: 8 Layers
Stack-up Construction: 2+4+2 HDI Buildup
Base Material: IT180A
Finished Board Thickness: 1.0 mm
Copper Thickness (Inner/Outer): 0.5 oz (1/1 oz Finished)
Solder Mask Color: Green or White
Surface Finish: Immersion Gold (ENIG)
Minimum Trace/Space (BGA Area): 3 mil / 3 mil
Special Technology: None Specified
Primary Application: Digital Electronics PCB

12-Layer 3rd-Order HDI Communication PCB

12-Layer 3rd-Order HDI Communication PCB

Model: 12-Layer 3rd-Order HDI Communication PCB
Layer Count: 12 Layers
Base Material: TU872slk (High-Performance FR-4 Equivalent)
Finished Thickness: 1.2 mm
Copper Weight: 0.5 oz/ft² (Approx. 17.5 μm)
Color: Blue Solder Mask / White Silkscreen
Surface Finish: Immersion Gold (ENIG – Electroless Nickel Immersion Gold)
Special Technologies: None (Standard HDI Process)
Minimum Trace & Space: 2.5 mil / 2.5 mil (63.5 μm / 63.5 μm)
Application: High-Speed Communication Equipment PCBs (e.g., Routers, Switches, Telecommunication Modules)

Specializing in the Manufacturing of High-Quality Printed Circuit Boards

Specializing in the Manufacturing of High-Quality Printed Circuit Boards

Substrate Material: Isola FR408 (High-Performance Flame-Retardant Laminated Material)
Layer Configuration: 6-Layer, 2+N+2 HDI (High-Density Interconnect) Structure
Surface Finish Color: Black / White
Final Board Thickness: 0.3 mm

8-Layer HDI 2+N+2 Mobile Main Board

8-Layer HDI 2+N+2 Mobile Main Board

Model: 2+N+2 Mobile Main Board
Layer Count: 8 Layers
Base Material: TG170 FR-4
PCB Construction: 2+4+2 HDI Stackup
Board Thickness: 0.8 mm (Finished)
Copper Weight: 0.5 oz
Solder Mask: Green/White
Surface Finish: ENIG with OSP (Immersion Gold + Organic Solderability Preservative)
Minimum Trace/Space: 3 mil / 3 mil
Minimum Via Size: 0.1 mm Laser-drilled Micro-via
Application: Mobile Main Board

8-Layer HDI PCB for Mobile Motherboard

8-Layer HDI PCB for Mobile Motherboard

Product Designation: 8-Layer 2+N+2 Mobile Main Board PCB
Base Material: FR-4
Layer Construction: 8-Layer HDI (High-Density Interconnect) with 2+N+2 stack-up
Board Thickness: 1.0 mm (finished)
Copper Weight: 1 oz (finished)
Solder Mask Color Options: Green or White
Surface Finish: Immersion Gold (ENIG)
Minimum Line Width / Spacing: 3.5 mil / 3.5 mil
Minimum Drilled Hole Sizes:
Mechanical Drill: 0.2 mm
Laser Micro-via: 0.1 mm
Primary Application: Mobile Device Main Logic Board (Motherboard)