PCB Layer Count:​ Up to 12 layers.
Substrate Material:​ High-TG FR-4, with a Glass Transition Temperature (Tg) of 170°C.
Surface Finish:​ Lead-Free Hot Air Solder Leveling (HASL) or Electroless Nickel Immersion Gold (ENIG).
Gold Finger/Contact Plating Thickness:​ 2 to 5 micro-inches (µ").
Solder Mask:​ Standard green; customizable upon request.
Copper Weight (Finished):​ Ranging from 0.5 to 6 oz.
PCB Base Substrate Copper Clad:​ 0.5 to 5 oz.
PCB Solder Mask Color Options:​ Green, Black, White, Red, Blue.
Testing & Validation:​ PCB Electrical Test (E-Test) and full PCBA Functional Test are included.
Target Application:​ Automotive Electronics and General Electronic Products.

PCB Construction:​ 4-6 Layer Multilayer Architecture
Base Substrate:​ High-Frequency Laminated Material (RO3003 core with Isola 370HR)
Surface Finish:​ Immersion Silver (ENIG Alternative Not Specified)
Copper Weight:​ 1 oz/ft² (Standard Thickness)
Board Color Options:​ Green/Black/White/Red/Blue (Solder Mask)
PCB Electrical Test:​ Included (Board-Level)
Primary IC:​ Texas Instruments IWR1843BOOST Integrated Circuit
Functional Test Coverage:​ PCBA-Level Testing Excluded
Operational Frequency Band:​ 76–81 GHz FMCW (Frequency-Modulated Continuous Wave)
Functional Application:​ Millimeter-Wave Radar Sensing Solution

Product Designation:​ Light LED PCBA (Printed Circuit Board Assembly)
PCB Construction:​ Configurable as 1 or 2-layer board.
Base Material Options:​ FR-4 Epoxy, Aluminum Substrate, or Copper Core (IMS).
Surface Finish:​ Lead-Free Hot Air Solder Leveling (HASL) or Organic Solderability Preservative (OSP).
Solder Mask:​ White.
Copper Weight (Finished):​ Ranging from 0.5 oz to 2.0 oz.
Legend/Silkscreen:​ Black.
Quality Assurance:​ Includes bare board (PCB) testing and in-circuit (PCBA) testing.
Primary Application:​ Specifically designed for LED lighting solutions and assemblies.

PCB Construction:​ Up to 56 layers
Substrate Material:​ FR-4, High Tg (High Glass Transition Temperature)
Surface Finish:​ Electroless Nickel Immersion Gold (ENIG)
Gold Thickness:​ 2 to 5 microinches (µ")
Solder Mask:​ Green LPI (Liquid Photoimageable)
Copper Weight:​ 0.5 oz/ft² to 2.0 oz/ft²
PCB Color Options:​ Green, Black, White, Red, Blue
PCB Test:​ Mandatory (e.g., Flying Probe/Test Coupon)
PCBA Test:​ Mandatory (In-Circuit Test / Functional Test)

Board Construction:​ 4-Layer Printed Circuit Board
Substrate Material:​ High-Frequency/High-Speed Laminate
Surface Finish:​ Lead-Free Hot Air Solder Leveling (HASL) or Immersion Gold (ENIG)
Gold Thickness (ENIG):​ 1 to 5 Microinches (µ")
Solder Mask:​ Standard Green
Copper Thickness:​ 0.5 oz to 6 oz (External Layers); 0.5 oz to 5 oz (Internal Layers)
Quality Assurance:​ 100% PCB Electrical Testing & Full PCBA Functional/In-Circuit Testing (ICT)
Application:​ Designed for RF Communication Systems

Base Material:​ Woven Glass Fiber Substrate
Dielectric Insulation:​ High-Temperature Polyimide (PI) Resin
Layer Thickness Specification: Flexible Layer: 0.15 mm
Rigid Board Segment: 0.50 mm (±0.03 mm tolerance)
Board Dimensions:​ Customer-Defined Single-Chip Size
Conductor Foil:​ 18 μm (0.5 oz) ED Copper
Solder Mask Options:​ LPI (Green) or Photoimageable Film (Yellow, Black, White)
Surface Finish:​ Organic Solderability Preservative (OSP), 12-36 μm
Flammability Rating:​ UL 94 V-0
Thermal Reliability:​ Solder Heat Resistance Test @ 288°C for 10 seconds

Stack-up: 6-layer construction
Surface Finish: Immersion Gold (ENIG)
Gold Thickness: 2 microinches
Solder Mask: Red
Testing: PCB electrical testing (included)
PCBA functional testing (included)
Supply Scope: PCB manufacturing (provided by Pcbmo)
Full electronic component procurement (provided by Pcbmo)
PCBA Testing Protocol: Customer-supplied test procedures (video format required)
Compliance: RoHS-certified lead-free assembly