Product Designation:​ Sensor IC Substrate
Base Material:​ Shengyi SI10U Laminate
Min. Line Width/Space:​ 35μm / 35μm
Surface Finish:​ Immersion Gold (ENIG)
Board Thickness:​ 0.25 mm
Layer Count:​ 4 Layers
Construction Stack-up:​ 1L-4L, 1L-2L, 3L-4L
Solder Mask:​ Taiyo PSR-4000 AUS308
Via Specifications:​ Laser-drilled Via: 0.075mm; Mechanical Via: 0.1mm
Application:​ Sensor IC Substrate

Product Model:​ CC-HL820WDI
Base Material:​ Component Substrate PCB
Layer Count:​ 2 layers
Board Thickness:​ 0.3 mm
Solder Mask:​ PSR-4000 WT03
Surface Finish:​ Hard Gold Plating
Minimum Via Diameter:​ 0.25 mm
Minimum Line Spacing:​ 75 µm
Minimum Line Width:​ 75 µm
Primary Application:​ Substrate for Electronic Components

Model:​ Component Substrate PCB
Construction:​ 2-Layer Build
Base Material:​ CC-HL820WDI
Board Thickness:​ 0.3 mm
Solder Resist:​ PSR-4000 WT03
Surface Finish:​ Electrolytic Hard Gold
Minimum Drill Aperture:​ 0.25 mm
Minimum Trace Width:​ 75 µm
Minimum Trace Spacing:​ 75 µm
Application:​ Electronic Components Substrate

Model:​ Blind Via IC Substrate
Base Material:​ Mitsubishi Gas HF BT HL832NX
Layer Count:​ 8-Layer Construction
Board Thickness:​ 0.6 mm
Unit Dimensions:​ 40 mm x 55 mm
Solder Mask:​ PSR-4000 AUS308
Surface Finish:​ Soft Gold
Minimum Laser Drill Aperture:​ 0.1 mm
Minimum Trace/Space:​ 30 µm / 30 µm
Primary Application:​ High-Density Interconnect (HDI) IC Substrate with Blind Vias

Model:​ USB 3.0 PCB Substrate Board
Base Material:​ SI10U
Layer Count:​ 4L
Board Thickness:​ 0.3 mm
Outline Dimensions:​ 12.8 mm x 38.8 mm
Solder Mask:​ PSR-2000 BL500
Surface Finish:​ Soft Gold
Minimum Fabrication Tolerances: Drilled Hole Aperture:​ 0.1 mm
Conductor Spacing (Line Distance):​ 75 µm
Conductor Width (Line Width):​ 40 µm
Application:​ USB 3.0 PCB Substrate Board

Product Designation:​ Fingerprint Card IC Package Substrate
Dielectric Material:​ Shengyi S110U (an advanced laminated substrate material)
Construction:​ 2-Layer (2L) stack-up
Overall Thickness:​ 0.2 mm
Unit Dimensions:​ 11.0 mm x 11.0 mm
Solder Mask:​ PSR-4000 AU5306 (a photoimageable solder resist)
Surface Finish:​ Electroless Nickel Immersion Gold (ENIG), comprising a combination of Soft Gold and Hard Gold
Manufacturing Capabilities / Critical Dimensions: Minimum Via Aperture:​ 0.1 mm
Minimum Line Width / Space:​ 75 µm / 75 µm
Minimum Trace Width:​ 35 µm
Application:​ Specifically engineered for use as the package substrate for integrated circuits in fingerprint recognition cards.