Requirements for FPC Manufacturing in Medical Products
Circuit Formation (Etching):
1、Fine Line Width/Space: Typically required to achieve 50μm/50μm or even smaller (e.g., 25μm/25μm), with strict tolerances (e.g., ±10%).
2、Undercut Control: Requires minimal undercut, resulting in a near-rectangular line cross-section.
Via Hole:
1、Hole Wall Quality: Hole walls must be smooth, free of resin smear and burrs.
2、Plated Copper Thickness: The copper thickness inside the via must meet a certain standard (e.g., average 15-25μm) and be uniform.
Coverlay Lamination:
1、Registration Accuracy: Requires extremely high alignment accuracy (e.g., ±50μm) between the Coverlay opening and the pads.
2、Void-Free Lamination: The lamination process must be performed in a vacuum environment to ensure no bubbles or voids between the substrate, adhesive layer, and copper circuits.
Surface Finish:
Reliability Priority: Common finishes include ENIG or Hard Gold Plating. ENIG offers a flat surface suitable for soldering; hard gold is wear-resistant, ideal for connector contacts. Solder Mask must also be a biocompatible type.
Cleanliness:
Very Low Ionic Contamination: Requires ultra-low levels of ionic contamination (e.g., Chlorides < 0.2 μg/cm² NaCl equivalent).
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