Advanced Substrate Materials:​ Teflon or Ceramic-based laminates.
Quality Certification:​ Manufactured in compliance with IPC-6012 standards.
Electrical Characteristics:​ Dielectric Constant (Dk) adjustable from 2.0 to 16.0.
Construction Flexibility:​ Configurable from single-layer to complex 70-layer stack-ups.
Dimensional Specifications: Board Thickness: 0.254 mm to 6.0 mm.
Copper Weight: Standard H/H oz (1 oz finished copper thickness).
Surface Finish:​ Primary finish: Immersion Silver. Alternatives available: Gold or OSP (Organic Solderability Preservative).
Targeted Applications:​ Communication Radar Systems; Detection and Sensing Radar Systems.

Product Title:​ Cavity PCB
Technical Specifications: Product Designation:​ Cavity PCB
Base Material:​ PTFE/Fluoropolymer (F4MB)
Quality Conformance:​ IPC-6012 Class 2
Dielectric Constant (Dk):​ 2.55
Layer Construction:​ 2-Layer
Board Thickness:​ 1.5mm
Copper Thickness:​ 0.5oz Base / 1oz Finished
Surface Finish:​ Immersion Silver (Imm-Ag)
Application:​ Cavity PCB for Power Divider

Material:​ Rogers 4350B Laminate
Construction:​ 2-Layer Board
Dielectric Thickness:​ 0.254 mm - 1.524 mm
Dielectric Constant (Dk):​ 3.48
Thermal Conductivity:​ 0.69 W/m·K
Copper Thickness:​ Base Copper 0.5 oz, Finished Copper 1 oz
Board Thickness:​ 0.35 mm - 1.7 mm
Surface Finish:​ ENIG (Electroless Nickel Immersion Gold) / Immersion Silver
Minimum Trace/Spacing:​ 4 mil / 4 mil

Base Material:​ Rogers 4003 Laminate
Dielectric Constant (Dk):​ 3.38
Layer Build-up:​ Rogers 4003 core with 4450F prepreg
Core Thickness:​ 0.508 mm (20 mil)
Overall Finished Board Thickness:​ 2.0 mm
Base Copper Thickness (Substrate):​ 17 µm
Final Copper Thickness:​ 1 oz
Surface Finish:​ Immersion Gold (ENIG)
Solder Mask Color:​ Green / White
Minimum Trace Width / Spacing:​ 6 mil / 6 mil
Key Features:​ High-Temperature Rogers PCB, High Tg (280°C)

Base Material:​ Rogers 5880 laminate/substrate
Layer Count:​ 1 to 24 layers
Dielectric Constant (Dk):​ 2.2 (@ 10 GHz, RT)
Thickness Range:​ 0.2 mm - 4.8 mm
Surface Finish:​ Immersion Gold (ENIG)
Copper Thickness:​ Base 0.5 oz, Finished 1 oz
Specialized Capabilities: PTFE-Based Multilayer Construction Countersink Holes
Primary Applications:​ Microwave Technology, Instrumentation, Communication Systems

Constitution:​ Teflon/Ceramic-FR4 Composite Substrate
Quality Compliance:​ IPC 6012 Class 2/3 Certification
Dielectric Constant Range:​ 2.2 - 16.0
Material Composition:​ Hybrid/Mixed Dielectric Laminate
Layer Construction:​ 2 to Multilayer Architecture
Board Thickness Range:​ 0.1 - 12.0 mm
Copper Weight:​ 0.5 - 3.0 oz
Surface Finish Options:​ Immersion Silver, Electrolytic Gold, OSP
Primary Application:​ High-Frequency Microwave Circuitry