Base Material:​ Isola 370HR High-Tg Laminate
Electrical Properties: Dielectric Constant (Dk): 4.04
Dissipation Factor (Df): 0.021
Thermal Performance: Glass Transition Temperature (Tg): 180°C
Decomposition Temperature (Td): 340°C
Construction: Layer Count: 6 Layers
Finished Board Thickness: 1.0 mm
Copper Weight (Finished): 1 oz
Fabrication Details: Surface Finish: Immersion Gold (ENIG)
Minimum Trace Width/Space: 4 mil / 4 mil
Application:​ Data Storage Products

Product Type:​ Communication Backplane PCB
Base Material:​ Isola 370HR Laminate
Electrical Properties: Dielectric Constant (Dk): 4.04
Dissipation Factor (Df): 0.021
Thermal Performance: Glass Transition Temperature (Tg): 180°C
Decomposition Temperature (Td): 340°C
Construction: Layer Count: 14 Layers
Overall Thickness: 2.4 mm
Copper Weight: 1 oz
Fabrication Details: Surface Finish: Immersion Gold (ENIG)
Minimum Trace/Space: 6/6 mil

Model:​ High-Performance FPGA Circuit Board
Construction Material:​ TG180 Laminate
Layer Count:​ 10-Layer Stack-up
Board Thickness:​ 1.6 millimeters
Copper Weight:​ 1 oz (Inner & Outer Layers)
Solder Mask:​ Blue/White
Minimum Trace/Spacing:​ 4/4 mil
Surface Finish:​ 5μ" Hard Gold
Primary Application:​ FPGA-Based High-Speed Printed Circuit Board.

Model:​ 20-Layer High-Speed PCB
Construction Material:​ TUC / TU872LK
Layer Count:​ 20 Layers
Final Thickness:​ 5.0 mm
Copper Thickness (Inner/Outer):​ 1 OZ
Solder Mask Color Options:​ Green / White
Minimum Trace/Spacing:​ 4 mil / 4 mil
Surface Finish:​ Hard Gold (3–15 μm)
Blind Via Configuration:​ L3 to L20
Primary Application:​ Communication Backplane PCB

General: Technology: Millimeter Wave Radar PCB
Model: 77G / 24G
Materials: Laminate: Rogers RO4835 laminates with S1000-2 prepreg
Alternative Laminate: Rogers RO3003G2 high-frequency laminate combined with ITEQ IT180 or Isola 370HR for the multilayer construction
Electrical Properties: Dielectric Constant (Dk): 3.48 / 3.0 (typical for specified materials)
Construction: Layer Count: 6-layer or 8-layer configuration
Finished Board Thickness: 1.0 mm to 2.0 mm
Conductivity: Copper Thickness (Finished): 0.5 oz/ft² or 1.0 oz/ft²
Physical Attributes: Solder Mask Color: Green, Blue, or Red
Fabrication Capability: Minimum Trace Width / Spacing: 4 mil / 4 mil
Surface Finishes: Final Surface Finish: Electroless Nickel Immersion Gold (ENIG) or Immersion Silver
Through-Hole Treatment: Via Capping/Filling (Resin Plug)

Model/Type:​ Rogers RO4350B and FR4 Hybrid Press PCB
Laminate Material:​ Rogers RO4350B high-frequency laminate combined with IT80A (mid-loss FR4) core.
Dielectric Constant (Dk):​ 3.48 (typical/@10GHz/23°C for RO4350B)
Layer Count:​ 4 Layers
Overall Finished Thickness:​ 1.2 mm
Copper Thickness (Finished):​ 0.5 oz/inner layer; 1 oz/outer layer
Solder Mask Color Options:​ Green or White
Minimum Trace Width/Space (Line/Space):​ 4 mil / 4 mil
Surface Finish:​ Immersion Gold (ENIG)
Primary Application:​ High-precision Environmental Testing Instrumentation