Base Material:​ Polytetrafluoroethylene (PTFE) based laminate
Quality Compliance:​ Conforms to IPC-6012, Class II/III
Electrical Properties: Dielectric Constant (Dk): 2.0 - 3.5
Dissipation Factor (Df): Controlled (as per material requirements)
Construction: Layer Count: 2 to 34 layers
Board Thickness: 0.1 mm - 12.0 mm
Copper Thickness: Starting (Base) Copper: 0.5 oz
Final (Finished) Copper: 1.0 oz
Surface Finish:​ ENIG (Electroless Nickel Immersion Gold), Immersion Silver (ISIG)
Critical Requirements: High-precision RF transmission line fabrication
Tight control over material Dk/Df parameters
Primary Application:​ High-frequency microwave circuit boards

Base material：
High-Frequency/High-Speed Laminates (e.g., Rogers, Taconic, Panasonic Megtron)
High Glass Transition Temperature (Tg) ≥ 170°C
Low Dielectric Constant (Dk) and Low Dissipation Factor (Df)
Design and Structure：
Multilayer Board, typically 8-20 layers or more
High-Density Interconnect (HDI) Structure: microvias, blind vias, buried vias
Controlled Impedance: Single-ended 50Ω, Differential 90Ω/100Ω, Tolerance ±10%
Minimum Trace Width/Space: 3/3 mil (0.075mm) or less
Surface treatment：
Electroless Nickel Immersion Gold (ENIG)
Thermal Management：
Heavy Copper (2 oz and above)
Thermal Vias
Coating and Protection：
Solder Mask conforming to IPC-CC-830B standard
Reliability & Standards：
Conforms to IPC-A-600G Class 2/3 Standard

Microwave PCB Manufacturing Technical Parameters

1、Core Materials
Substrate Type:​ PTFE-based high-frequency materials (e.g., Rogers series), Ceramic-filled PTFE composites, Hydrocarbon-based (HBN) laminates
Dielectric constant:​ 2.2 to 10.0+ (selected based on design), Tolerance tightly controlled to ±0.05 or better
Tangent of the loss angle:​ Very low, typically in the range of 0.0009 (e.g., RT/duroid 5880) to 0.004
Thermal conductivity:​ High thermal conductivity required for some applications (e.g., Rogers TC series, >1.0 W/m/K)

2、Design & Structure
Impedance Control:​ Tightly controlled, typically ±5% or tighter (e.g., ±3%), modeled for microstrip, stripline, etc.
Trace Width/Space Tolerance:​ Very tight, typically ±0.02mm or better, to ensure consistent electrical performance
Lamination Registration Tolerance:​ Tightly controlled within ±0.05mm to prevent misalignment in multilayer boards
Surface Finish:​ Electroless Nickel Immersion Gold (ENIG), ENEPIG, Immersion Silver, OSP

3、Critical Manufacturing Processes
Hole Plating:​ High requirements for hole wall quality, using plating processes for high aspect ratios to ensure signal integrity at microwave frequencies
Pattern Etching:​ Tight control of undercut to ensure smooth trace edges and clean profiles, minimizing signal loss
Lamination Process:​ Precise control of pressure, temperature, and time to avoid material deformation and changes in dielectric properties

4、RF Performance
Insertion Loss:​ Required to be very low at target frequencies (e.g., 10GHz, 20GHz)
Phase Consistency:​ Phase difference between different paths in multi-channel systems must be tightly controlled
Quality Factor (Q-value):​ Required for circuits like resonators, demanding high-Q materials