\Model:​ Multilayer PCB
Material:​ KB6061, S1141, S1000, IT180
Layer:​ 4Layer - 48Layer Multilayer PCB
Solder Mask Color:​ Green/White/Blue/Red
Silk Screen Color:​ White/Black
Finished Thickness:​ 0.3mm - 6.0mm
Copper Thickness:​ 0.5-6OZ
Surface Treatment:​ Immersion Gold/OSP/HASL
Min Trace:​ 3mil(0.75mm)
Min Space:​ 3mil(0.75mm)
Application:​ Consumer electronics

Model: 26 Layer PCB
Material:​ S1141, S1000, 370HR
Layer:​ 6 Layer Circuit
Solder Mask Color:​ Green
Silk Screen:​ White
Finished Thickness:​ 1.0mm
Copper Thickness:​ 1/H/H/H/H1 OZ
Surface Treatment:​ Immersion Gold/OSP
Min Trace:​ 3mil(0.75mm)
Min Space:​ 3mil(0.75mm)
Application:​ Consumer electronics
Certificate:ROSH. ISO9001. UL. ISO13485

Model:​ Server Power Module PCB
Material:​ High TG FR4
Layer:​ 24Layers
Color:​ Green/White
Finished Thickness:​ 1.0mm
Copper Thickness:​ 2-3OZ
Surface Treatment:​ Immersion Gold
Min Trace:​ 8mil (0.2mm)
Min Space:​ 8mil (0.4mm)
Application:​ Power Module PWB
Certificate:ROSH. ISO9001. UL. ISO13485

BGA PCB Manufacturing
Model:​ BGA PCB
Material:​ FR-4
Layer:​ multilayer
Color:​ Green/White
Finished Thickness:​ 1.2mm
Copper Thickness:​ 1/1OZ
Surface Treatment:​ Immersion Gold
Min Trace:​ 4mil
Min Space:​ 4mil
Application:​ electronic product

Product Model:​ 10Layer ENIG Board
Base Material:​ TU-768 Laminate
Layer Count:​ 10 Layers
Solder Mask:​ Green over White Legend
Board Thickness:​ 1.0mm Finished Thickness
Copper Weight:​ 2 to 3 oz (Inner/Outer Layers)
Final Surface Finish:​ Electroless Nickel Immersion Gold (ENIG)
Fabrication Capability:​ Minimum Trace Width/Space: 3mil/3mil

Service:​ Rapid-Turn Multilayer PCB Fabrication
Base Materials:​ FR-4, Polyimide (PI), Ceramic, PTFE (Teflon)
Layer Count:​ 2-Layer to High-Layer-Count Multilayer Boards
Lead Time:​ Expedited Turnaround as Quick as 12 Hours
Solder Mask Color:​ Green, Blue, Yellow, Red, Black
Board Thickness:​ 0.15 mm - 6.0 mm
Copper Weight:​ 0.5 oz - 12 oz
Surface Finish:​ ENIG (Electroless Nickel Immersion Gold), HASL (Hot Air Solder Leveling), OSP (Organic Solderability Preservative)
Minimum Trace/Space:​ 0.1 mm / 0.1 mm (4 mil / 4 mil) Application:​ Electronic Products and Systems

Construction Material:​ SY S1141 Laminate
Layer Count:​ 6-Layer Construction
Solder Mask / Appearance:​ Blue and White Solder Mask
Board Thickness:​ 1.0mm Finished Thickness
Copper Weights:Inner Layers:​ 1 oz (35 µm)，Outer Layers:​ 0.5 oz (17.5 µm)
Surface Finish:​ Immersion Gold (ENIG)
Fabrication Tolerance:​ 3/3 mil (0.075/0.075 mm) Trace/Space
Primary Application:​ Smart Android Robot Motherboard

Engineered for high-reliability automotive applications under harsh environments.
Construction:​ 14-Layer, Multilayer FR-4 with High Tg
Technology:​ May include HDI (Blind/Buried Vias) & Controlled Impedance
Thermal Reliability:​ High Thermal Reliability Material (≥150°C)
Surface Finish:​ Immersion Gold (ENIG) for excellent flatness and wire bonding capability
Key Specifications:​ Min. Trace/Spacing: 3/3 mil, Min.
Drilled Hole: 0.2 mm

Construction:​ 10-Layer Build
Base Laminate Material:​ TU-768 (Taiwan TUC)
Final Board Thickness:​ 1.60 mm (±10%)
Internal/External Copper Weight:​ 1 oz (H oz may be inferred for external)
Surface Finish:​ Electroless Nickel Immersion Gold (ENIG), 2.0 μ" Minimum Trace Width / Spacing:​ 3 mil / 3 mil (0.075 mm) Solder Mask Color:​ Green over White Silkscreen
Critical Requirement:​ Controlled Impedance, High-Precision
Primary Application:​ High-Frequency Communication Instrumentation

Construction:​ 6-Layer, Multilayer Board
Base Material:​ TG170 High TG FR4
Board Finishes:​ Green Solder Mask / White Silkscreen Finished Board Thickness:​ 0.8 mm
Copper Weights:
1、Inner Layers: 1 oz
2、Outer Layers: 0.5 oz
Surface Finish:​ Immersion Gold (ENIG)
Fabrication Tolerances: Minimum Trace Width / Spacing: 4 mil (0.1 mm)
Half-Hole (Castellated Hole) Specification: Plated Half-Hole Aperture: 0.5 mm
Key Characteristic:​ Half-Hole PCB Technology

Base Material: KB FR-4
Layer Construction: 6-Layer Multilayer PCB
Solder Mask Color: Green with White Silkscreen
Board Thickness: 1.2 mm
Copper Weight: 1 oz
Surface Finish: OSP (Organic Solderability Preservative)
Minimum Trace Width: 3 mil (0.075 mm) – BGA Area
Minimum Trace Spacing: 3 mil (0.075 mm) – BGA Area
Key Feature: Complies with TS16949 Automotive Quality Management System Standards
Application: Multilayer PCB Solutions for Automotive Mainboard Systems

Base Material: KB FR-4
Layer Construction: 6-Layer Multilayer PCB
Solder Mask Color: Green with White Silkscreen
Board Thickness: 1.2 mm
Copper Weight: 1 oz
Surface Finish: OSP (Organic Solderability Preservative)
Minimum Trace Width: 3 mil (0.075 mm) – BGA Area
Minimum Trace Spacing: 3 mil (0.075 mm) – BGA Area
Key Feature: Complies with TS16949 Automotive Quality Management System Standards
Application: Multilayer PCB Solutions for Automotive Mainboard Systems