Shengyi S1170G Datasheet

Shengyi S1170G is a high-Tg printed circuit board material formulated without halogen.
This grade provides resistance to conductive anodic filamentation, supports lead-free assembly processes, and ensures robust plated through-hole integrity. It is free of substances like antimony and red phosphorus.
Its primary applications include consumer and automotive electronics, mobile devices, computing equipment, and precision instruments.

S1170G Copper-Clad Laminate: Storage Guidelines
Proper Storage Method:
Store panels within their factory packaging on a flat platform or dedicated racking system. This prevents the application of excessive pressure, safeguarding against mechanical warping or deformation during storage.
Ideal Storage Conditions:
Maintain a controlled environment that is dry, well-ventilated, and at standard room temperature. It is critical to shield the materials from direct sun exposure, moisture, and contact with any corrosive chemical vapors, as these factors directly influence the integrity of the base substrate.
Guaranteed Material Shelf Life:
When stored under these specified conditions, the material's performance remains compliant with IPC4101 standards. Multilayer panels maintain their specified properties for up to 24 months, while single-layer boards have a shelf life of 12 months.
Safe Handling Procedures:
Always use clean gloves when handling the laminates. Avoid any sliding or impact that could compromise the delicate copper foil. Direct skin contact can lead to surface contamination; such imperfections may negatively affect subsequent processing and the final product's quality.

S1170G Prepreg: Storage and Handling Protocol
Correct Storage Practices:
Maintain prepreg rolls in a horizontal orientation within their sealed original packaging to prevent deformation from stacking pressure. Any leftover material following cutting must be immediately rewrapped with protective film to preserve integrity and returned to its designated storage rack.
Controlled Storage Environment:
Preserve prepreg in its unopened, light-resistant packaging, strictly avoiding UV exposure. Adherence to the following temperature and humidity parameters is critical for ensuring shelf life:
Standard Condition: Below 23°C and 50% relative humidity for a 3-month validity period.
Refrigerated Condition: Below 5°C to extend usability to 6 months.
Given humidity's profound effect on material quality, active dehumidification is necessary in damp conditions. Once the sealed package is opened, the prepreg should be utilized within a 72-hour window.
Precision Cutting Instructions:
Trained personnel should perform cutting operations while wearing lint-free gloves to avoid surface contamination. Meticulous care is essential to prevent the formation of creases or folds in the material during handling.

S1170G Prepreg Handling Guidelines: Remove material from cold storage and ensure a thorough warm-up phase prior to unsealing. The warming duration should exceed 8 hours (varies by storage setting), and the package should only be opened once it reaches room temperature; Pre-cut Prepreg must be kept in either Condition 1 or Condition 2 environments and utilized promptly. If storage exceeds 72 hours, reassess all properties for compliance before application; For roll-type Prepreg, after opening, reseal the remaining portion to its initial packaging standard and store under Condition 1 or 2.

If an IQC plan is in place, adhere to IPC-4101 standards. Testing should occur shortly after receipt (within 5 days maximum); When preconditioning sheet Prepreg in a drying cabinet, recommended settings are: temperature below 23°C, relative humidity near 40%, with fluctuations not surpassing 50%.

Hot Air Solder Leveling (HASL): S1170G is compatible with lead-free HASL processes.

Profile Machining: Employ CNC routing for outline fabrication with a moderately reduced feed rate. Shear cutting is not recommended for S1170G.

Final Packaging: Pre-packaging drying at 140°C for 4-6 hours is advised to prevent moisture-related thermal performance degradation. Use vacuum-sealed aluminum foil bags for packaging.

Shelf Life: Vacuum-sealed in aluminum foil, the material has a 3-month shelf life. Pre-baking at 125°C for 4-8 hours before use is recommended.

Reflow Soldering Profile: S1170G is suitable for standard lead-free reflow soldering processes.

Manual Soldering Parameters: For S1170G, maintain a soldering iron temperature between 350-380°C (using a temperature-controlled iron). Duration per joint should not exceed 3 seconds.