PTFE Ceramic Composite Dielectric Substrate TFA Series

PTFE ceramic composite dielectric substrate TFA series of products of the dielectric layer composition of PTFE resin and ceramic, do not use the glass ﬁber cloth dipping method to make prefabricated sheet, but the use of new technology to make prefabricated sheet, and then pressed by a special pressing process. With the same level of dielectric constant excellent electrical properties, thermal properties, mechanical properties, is aerospace grade high frequency high reliability materials, can replace similar foreign products.

TFA series of substrate does not contain glass ﬁber cloth, using a large number of uniform special nano-ceramics and resin mixture, electromagnetic wave propagation without glass ﬁber eﬀect, excellent frequency stability, dielectric loss of the same level of the lowest, the material X / Y / Z the lowest anisotropy, the material at the same time has the same as the copper foil low thermal expansion coeﬃcient, stable dielectric temperature characteristics.

The dielectric constant of this series is 2.94, 3.0, 6.15, 10.2. The TFA series comes standard with RTF low roughness copper foil, which reduces conductor loss while providing excellent peel strength.

TFA294 and TFA300 can be matched with buried 50Ω resistive copper foil to form resistive ﬁlm sheets. The circuit board can be processed by standard PTFE sheet technology. The excellent mechanical and physical properties of the sheet make it suitable for multilayer, high multilayer and backplane processing; at the same time, it shows excellent processability in the processing of dense holes and ﬁne lines.

TFA Series: Key Product Attributes
Minimal variation in dielectric constant with exceptional lot-to-lot uniformity.
Industry-leading low signal dissipation factor.
Supports high-frequency operations, including the 77 GHz band for automotive radar and millimeter-wave uses.
Stable electrical performance, including consistent frequency and phase response, across a wide thermal range from -55°C to 150°C.
High radiation tolerance, preserving dielectric and mechanical integrity post-exposure.
Minimal emission of gases in vacuum environments, verified per standard testing methods, aligning with aerospace application criteria for vacuum compatibility.
Matched thermal expansion rate with copper foil, promoting the reliability of plated through-holes and dimensional steadiness.
Low moisture intake, guaranteeing performance consistency in high-humidity conditions.
TFA Series: Primary Use Cases
Aerospace and aviation systems, including spacecraft, cabin electronics, and airframes.
RF components, such as microwave circuits, antennas, and phase-critical arrays.
Radar systems for detection, early warning, and avionics.
Active electronically scanned arrays and beam-forming circuitry.
Satellite-based communication and global positioning systems.
High-frequency signal amplification units.