Prepreg Dk = 2.2 F4-PP220 Datasheet

Prepreg Dk = 2.2 F4-PP220 Datasheet

This is a pre g used in high-frequency multi-layer PCB, with DK=2.25 DF=0.0015 for F4-PP220 at a frequency of 10GHz.

Optimized Features of F4-PP220 Prepreg
F4-PP220 is a thermoset polymer film featuring very low dielectric constant and loss. Its glass-free composition ensures outstanding signal integrity at high frequencies, making it suitable for millimeter-wave and radar applications.
This material offers high thermal reliability, capable of enduring three reflow soldering cycles without any signs of delamination or blistering.
It demonstrates superior bonding strength with various base materials and copper foils, including FR-4, PTFE, PI, high-speed laminates, and even single-sided LCP boards.
Lamination is achieved using standard PCB vacuum press equipment, eliminating the need for high-temperature processes. Recommended parameters are 160–170°C, 2.8–3.8 MPa, for 60–90 minutes, and it supports multiple lamination cycles.
F4-PP220 exhibits minimal resin flow during the pressing process, ensuring dimensional stability.
It is an environmentally friendly, halogen-free material that meets the UL94-V0 flame retardancy standard.

                                                                    Prepreg Dk = 2.2 F4-PP220