PCB high frequency PCBA Assembly

1、High-Frequency Material: Rogers 4350B

2This PCB is engineered with Rogers 4350B high-frequency laminate, an industry-advanced material specifically formulated for superior RF performance and minimal signal loss in demanding applications like 5G and aerospace.


2、Dielectric Constant: 3.48±0.05

It maintains a tightly controlled dielectric constant (Dk) of 3.48±0.05, a critical parameter achieved through state-of-the-art material synthesis that ensures consistent wave impedance and predictable high-speed signal propagation.


3、Impedance Control: ±5%

Precision impedance control within a strict ±5% tolerance is achieved utilizing advanced field solvers and automated processes, which is paramount for maintaining signal integrity in high-frequency and high-speed digital designs.


4、Low-Loss Copper Foil

The board incorporates ultra-low-profile, low-loss copper foil, a key material technology that significantly reduces surface roughness to minimize signal attenuation and skin effect losses at microwave frequencies.


5、Surface Finish: Immersion Silver

Featuring an immersion silver (ImmAg) surface finish, this PCB provides a flat, highly conductive surface that ensures excellent solderability and reliable performance for RF connections, while offering superior oxidation resistance.


6、Signal Integrity Optimization

Every aspect of this PCB is designed for comprehensive signal integrity optimization, from material selection to controlled impedance and low-loss fabrication, guaranteeing maximum performance for high-frequency analog and high-speed digital circuits.