This standard 2-layer PCB utilizes a 1.6mm profile, a benchmark in circuit board manufacturing achieved through advanced lamination processes. This ensures optimal rigidity and compatibility for a wide range of electronic applications, supporting durability and ease of assembly.

2. 1oz (35μm) Copper Weight

Ensuring reliable conductivity, the board features a 1oz (35μm) copper weight, applied with precision using state-of-the-art electrodeposition techniques. This uniform copper cladding guarantees consistent signal integrity and current-carrying capacity for robust performance.3. Min. Trace/Space: 0.15mm

A minimum trace/space capability of 0.15mm is enabled by high-precision imaging and etching technologies. This allows for fine-pitched, high-density circuit designs, meeting the demands of compact and complex modern electronics.4. Min. Drill Size: 0.3mm

Supporting various components, the board offers a minimum drill size of 0.3mm via automated, laser-guided drilling systems. This precision ensures accurate via formation and reliable interlayer connections for complex circuit layouts.

5. Surface Finish: HASL (Lead/Lead-Free)

The surface finish employs Hot Air Solder Leveling (HASL), available in both Lead and Lead-Free formulations, applied with controlled immersion and leveling technology. This provides a highly solderable, durable surface, enhancing connection reliability and environmental compliance.

6. Material: FR-4 TG130

Fabricated from high-performance FR-4 TG130 material, the board guarantees thermal stability and mechanical strength. This halogen-free substrate, manufactured under stringent controls, ensures excellent performance in demanding thermal environments.