1. Heavy Copper: 3-6oz

This board utilizes advanced heavy copper PCB fabrication, featuring 3 to 6-ounce copper weights. This sophisticated process significantly enhances current carrying capacity, improves thermal performance, and ensures exceptional mechanical durability in connectors and high-power special applications.

2. Ultra-Thin Core: 0.4mm

Achieving an ultra-thin 0.4mm core is a result of precision lamination and substrate handling technologies. This allows for a highly compact and lightweight circuit board design, which is critical for advanced, space-constrained applications like wearable technology and miniaturized medical devices.

3. Rigid-Flex Technology

The integration of rigid-flex technology combines the stability of rigid boards with the dynamic flexibility of circuits. This state-of-the-art approach enables three-dimensional packaging, reduces interconnection points for higher reliability, and is ideal for complex applications requiring repeated bending.

4. High TG Material: >180°C

Constructed with high-performance High TG (Glass Transition Temperature) materials rated over 180°C, this board offers superior thermal resistance. This ensures stable mechanical and electrical properties, preventing deformation or failure in high-temperature and harsh operating environments.

5. Custom Solder Mask Colors

The board supports full customization of solder mask colors using advanced inkjet printing and liquid photoimageable (LPI) techniques. This allows for brand-specific color coding, improved aesthetics, and easy visual identification of different board versions or revisions without compromising protection.

6. Hard Gold Finger Plating

Edge connectors feature hard gold plating via selective electroplating. This advanced surface finish provides superior contact conductivity, excellent resistance to wear from frequent insertion/withdrawal cycles, and robust corrosion resistance, guaranteeing long-term connection reliability.