In the realm of advanced electronics, the demand for high-density interconnect (HDI) PCBs that offer robust performance in constrained spaces is ever-increasing. Our manufacturing capabilities are designed to meet these challenges head-on. A prime example of our expertise is our standard offering for a 10‑layer PCB built with Immersion Gold (ENIG) finish, which exemplifies our commitment to precision and quality.
This specific board configuration is engineered for applications requiring superior signal integrity, complex routing, and reliable long‑term performance. Below, we detail the key technical specifications that define our manufacturing prowess for such multi‑layer boards.
Layer Stack‑up & Material:
This 10‑layer board is constructed on high‑quality TU‑768 laminate, a material chosen for its excellent thermal and electrical properties, ensuring stability and reliability across various operating conditions.
Controlled Impedance & Copper Thickness:
To cater to high‑power and high‑frequency designs, we support a substantial copper weight of 2 to 3 ounces per square foot. This capability is critical for power distribution networks and applications requiring significant current carry capacity, while also allowing for precise controlled impedance routing.
High‑Density Interconnect (HDI) Features:
A standout feature of our process is the ability to achieve a minimum trace width and spacing of 3 mils (0.003 inches) . This level of precision is essential for routing complex ICs, such as BGAs and FPGAs, enabling higher component density and more compact product designs without compromising performance.
Final Board Thickness:
The finished product is manufactured to a precise overall thickness of 1.0 mm. This thin‑profile, yet robust, build is ideal for space‑sensitive applications like wearable technology, advanced telecommunications modules, and miniaturized medical devices.
Surface Finish – Electroless Nickel Immersion Gold (ENIG):
The board features an ENIG surface finish as the final plating. This finish provides a flat, planar surface that is ideal for fine‑pitch components, offers excellent oxidation resistance for extended shelf life, and ensures a reliable, solderable surface for strong gold‑wire bondable connections.
Solder Mask and Identification:
The standard configuration includes a green solder mask over white silkscreen legend, providing clear component identification and a professional appearance. Alternative colors are available upon request to meet specific aesthetic or functional requirements.
This 10‑layer ENIG PCB is particularly suited for demanding sectors, including:
Network Infrastructure: Routers, switches, and communication servers.
Industrial Automation: High‑speed control systems and power controllers.
Medical Electronics: Diagnostic equipment and portable monitoring devices.
Aerospace and Defense: Avionics and mission‑critical control systems.
Our ability to consistently produce 10‑layer PCBs to these exacting standards underscores our position as a leader in advanced PCB fabrication. We understand that your designs push the boundaries of technology, and our manufacturing capabilities are built to support that innovation.
For engineers and procurement specialists, choosing our services means selecting a partner dedicated to quality, precision, and reliability. We invite you to review these specifications for your next high‑layer count project.
Contact us today to discuss your specific requirements and receive a detailed quotation.
