Technical Specifications and Manufacturing Overview: 4-Layer Blue Solder Mask Rigid-Flex PCB
Rigid-Flex PCBs (R-FPCBs) represent a critical advancement in electronic interconnect solutions, combining the durability of rigid boards with the flexibility of circuits. This technical data sheet provides a detailed overview of a standard 4-layer construction with a blue solder mask, designed for applications where space, weight, and reliability are paramount.
Key Product Specifications
"This model is engineered to meet the demanding requirements of modern digital communication systems.
1、Product Designation: Blue Solder Mask Rigid-Flex PCB (R-FPCB)
2、Construction Type: 4-Layer Rigid-Flex
3、Base Material Composition: A hybrid stack-up utilizing FR-4 for the rigid sections and flexible Polyimide (PI) for the dynamic bending areas. This combination ensures excellent mechanical stability and high-temperature resistance.
4、Visual Identification: The board features a blue solder mask with white silkscreen, providing a high-contrast platform for component designation and branding.
5、Finished Board Thickness: The completed board has a precise thickness of 0.6mm, supporting a low-profile design for compact assemblies.
6、Copper Thickness: A standard 1 oz (0.025mm) copper cladding is used for the conductors, balancing current-carrying capacity with fine-line etching capabilities.
7、Surface Finish: The board undergoes an Immersion Tin (ISn) treatment. This finish offers a flat, planar surface, ideal for fine-pitch components and ensuring excellent solderability.
8、Fabrication Tolerance: The minimum trace width and spacing are 0.1mm / 0.1mm, indicating a capability for high-density interconnect (HDI) design rules."
Primary Applications and Industry Use
"The specified technical characteristics make this Rigid-Flex PCB particularly suitable for advanced communication and digital electronic systems. Its robust yet flexible design is optimal for:
1、Miniaturized wireless communication devices.
2、High-speed digital data transmission equipment.
3、Wearable technology and compact sensor modules.
4、Aerospace and military avionics where reliability under stress is critical."
Manufacturing and Quality Considerations
Producing a reliable Rigid-Flex PCB requires precise control over the lamination process of the FR-4 and PI materials to ensure integrity at the rigid-flex junctions. The 0.1mm line width specification demands advanced imaging and etching techniques. The selection of immersion tin as a surface finish provides a cost-effective and reliable solution for most assembly processes, though alternatives like ENIG (Electroless Nickel Immersion Gold) may be recommended for more demanding applications with extended shelf-life requirements.
This 4-layer Blue Solder Mask Rigid-Flex PCB specification outlines a versatile and high-performance interconnect solution. Its design is tailored for the rigorous demands of next-generation communication digital products, offering an optimal balance of flexibility, durability, and circuit density. For detailed design guidelines or a project-specific quotation, please contact our engineering team.
Product Designation: Blue Solder Mask Rigid-Flex PCB (R-FPCB)
Base Material: FR-4 / Polyimide (PI) Combination
Layer Count: 4-Layer Construction
Solder Mask / Silkscreen Color: Blue / White
Finished Board Thickness: 0.6 mm
Copper Foil Thickness: 0.025 mm (1 oz equivalent)
Surface Finish: Immersion Tin (ISn) Treatment
Minimum Trace Width / Spacing: 0.1 mm / 0.1 mm
Primary Application: Communication and Digital Electronic Systems utilizing Rigid-Flex PCB (R-FPCB) technology.
