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Technical Overview: High-Reliability 6-Layer Castellated Half-Hole PCB for Demanding Applications
This technical data sheet provides a detailed specification for a advanced multilayer Printed Circuit Board (PCB) designed with castellated mounting holes (half-holes). This board is engineered for high-density electronic applications where reliable board-to-board connection or module integration is critical, such as in automotive, telecommunications, and industrial control systems.
1. PCB Construction and Material Selection
The foundation of this board is a 6-layer multilayer construction, which provides excellent routing density for complex circuits. The base material is a high-performance FR4 laminate with a Glass Transition Temperature (Tg) of 170°C. This high Tg rating ensures superior thermal and mechanical stability, preventing deformation or delamination during soldering processes and in high-temperature operating environments. The board features a standard green solder mask over a white silkscreen legend for component identification.
2. Critical Physical and Electrical Specifications
1、Finished Thickness: The board is manufactured to a precise finished thickness of 0.8 mm, making it a robust yet relatively slim solution for compact assemblies.
2、Copper Cladding: To optimize electrical performance and current-carrying capacity, the board utilizes a differential copper weight configuration. The inner layers are constructed with 1 oz (35 µm) copper foil, while the outer layers use 0.5 oz (17.5 µm) copper. This design supports controlled impedance for inner layer signals while facilitating fine-line etching on the outer layers.
3、Surface Finish: The board is treated with Immersion Gold (ENIG) over the copper pads. ENIG provides a flat, solderable surface, excellent for fine-pitch components, and offers superior oxidation resistance for long-term shelf life.
4、Fabrication Precision: The board demonstrates high manufacturing precision with a minimum trace width and spacing of 4 mil (0.1 mm), enabling complex circuit designs.
3. Key Feature: Castellated Half-Hole Technology
The defining characteristic of this PCB is its castellated half-hole plating technology. These are plated through-holes that are drilled on the board edge and subsequently milled in half, creating a series of plated pads.
1、Half-Hole Aperture: The finished plated half-hole has a specified diameter of 0.5 mm.
2、Primary Application: This technology allows the PCB to be directly soldered onto a motherboards as a plug-in module, creating a strong mechanical and electrical connection. It eliminates the need for separate connectors, reducing both assembly height and cost.
4. Applications and Advantages
This combination of a high-Tg 6-layer substrate and castellated half-holes makes this PCB ideal for:
1、System-on-Module (SoM) or Computer-on-Module (CoM) designs.
2、Wireless communication modules (Wi-Fi, Bluetooth, LTE).
3、Automotive control units where vibration resistance and thermal reliability are paramount.
4、Industrial sensor interfaces and power regulation boards.
The use of TG170 material ensures long-term reliability under thermal cycling stress, while the castellated holes provide a robust and space-efficient interconnection method.