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Multilayer PCB Vehicle Mainboard
Base Material: KB FR-4
Layer Construction: 6-Layer Multilayer PCB
Solder Mask Color: Green with White Silkscreen
Board Thickness: 1.2 mm
Copper Weight: 1 oz
Surface Finish: OSP (Organic Solderability Preservative)
Minimum Trace Width: 3 mil (0.075 mm) – BGA Area
Minimum Trace Spacing: 3 mil (0.075 mm) – BGA Area
Key Feature: Complies with TS16949 Automotive Quality Management System Standards
Application: Multilayer PCB Solutions for Automotive Mainboard Systems
Product Details Data Sheet

Advanced 6‑Layer Multilayer PCB Vehicle Mainboard: Technical Specifications and Manufacturing Insights

The multilayer PCB vehicle mainboard represents a critical component in modern automotive electronic systems, where reliability, performance, and compliance with industry standards are essential. Designed for demanding automotive environments, this PCB integrates advanced manufacturing techniques to meet stringent quality and durability requirements.


Key Technical Specifications

  • Model: Multilayer PCB Vehicle Mainboard

  • Base Material: KB FR‑4, known for excellent thermal stability and electrical insulation

  • Layer Count: 6‑layer multilayer construction, enabling complex circuit routing and enhanced signal integrity

  • Solder Mask Colors: Available in green or white, with clear silkscreen legend for component identification

  • Board Thickness: 1.2 mm, balancing structural rigidity and space constraints

  • Copper Thickness: 1 oz, providing optimal current carrying capacity and thermal management

  • Surface Finish: OSP (Organic Solderability Preservative) , ensuring reliable solderability and oxidation resistance

  • Minimum Trace Width/Space: 3 mil (0.075 mm) in BGA areas, supporting high‑density interconnects and fine‑pitch components

  • Quality Certification: Complies with TS16949 automotive quality management standards, ensuring full traceability and process control


Manufacturing and Design Features

This automotive‑grade mainboard is engineered to perform under harsh operating conditions, including temperature extremes, vibration, and moisture. The 6‑layer stack‑up allows for separate signal, power, and ground planes, which reduces EMI and improves noise immunity. The use of FR‑4 material with a Tg value suitable for automotive applications ensures long‑term reliability.

The 3 mil trace and spacing capability, particularly in BGA regions, facilitates the integration of advanced processors and ICs commonly used in vehicle control modules, infotainment systems, and ADAS applications. OSP surface treatment offers a flat, environmentally friendly finish ideal for lead‑free soldering processes.


Application Scope

Ideal for use in engine control units (ECUs) , transmission controllerstelematics, and other automotive electronic mainboards where high reliability and conformity to automotive qualification standards are required.


Base Material: KB FR-4
Layer Construction: 6-Layer Multilayer PCB
Solder Mask Color: Green with White Silkscreen
Board Thickness: 1.2 mm
Copper Weight: 1 oz
Surface Finish: OSP (Organic Solderability Preservative)
Minimum Trace Width: 3 mil (0.075 mm) – BGA Area
Minimum Trace Spacing: 3 mil (0.075 mm) – BGA Area
Key Feature: Complies with TS16949 Automotive Quality Management System Standards
Application: Multilayer PCB Solutions for Automotive Mainboard Systems