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Technical Procurement Specification: High-Density Interconnect (HDI) PCB for Mobile Phone Applications
Document ID: TPS-PCB-HDI-60L-M01
Revision: 1.0
Date: [2025-12-11]
 
1.0 Scope and Purpose
This document defines the technical requirements and procurement specifications for a High-Density Interconnect (HDI) Printed Circuit Board (PCB) intended for use in advanced mobile phone applications. This specification ensures the board meets the necessary performance, reliability, and miniaturization standards.
2.0 Product Classification
Product Type: HDI PCB, 1st Order
Target Application: High-Performance Mobile Phones / Smartphones
3.0 Detailed Material and Construction Specifications
All materials and construction methods must comply with the following parameters to be considered acceptable for procurement.


4.0 Critical Manufacturing and Quality Requirements
4.1 Via Technology: The use of laser-drilled microvias, blind vias, and buried vias is mandatory to achieve the specified 1st Order HDI density. Via filling and plating must meet IPC-6012 Class 2/3 standards.
4.2 Registration: Layer-to-layer registration must be tightly controlled to ensure the reliability of the dense interconnect architecture.
4.3 Surface Finish: The surface finish shall be Electroless Nickel Immersion Gold (ENIG) or a superior alternative (e.g., ENEPIG, Immersion Silver) as agreed upon, to ensure excellent solderability and wire bonding capability.
4.4 Acceptance Standard: All boards must be manufactured, assembled, and tested in compliance with IPC-A-600 (Acceptability of Printed Boards) and IPC-6012 (Qualification and Performance Specification for Rigid Printed Boards).
5.0 Documentation and Delivery
The supplier must provide all necessary supporting documentation, including:
1、Certificate of Compliance (CoC)
2、Final Electrical Test Report
3、Quality Control (QC) Data Pack
Disclaimer:
This specification is intended as a guide for procurement. The final manufacturing requirements are subject to the detailed Gerber files, drill files, and a complete set of fabrication drawings that will be provided to the approved supplier.