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Substrate Material

FR-4 (standard), High-Tg FR-4, PI (flexible PCBA), LCP (high-frequency applications)

High-Tg FR-4 (Tg ≥ 170°C) for 5G mobile; PI for foldable phones

Substrate Thickness

Core + prepreg total thickness

0.2–1.0 mm (standard mobile); 0.1–0.3 mm (thin-film flexible PCBA)

Copper Thickness

Clad copper weight for signal/power layers

½ oz (18 μm), 1 oz (35 μm), 2 oz (70 μm) (power rails)

Solder Mask Material

Lead-free, high-temperature resistant, UV-curable

Epoxy-based solder mask; Color: Green/Black/White

Silkscreen Ink

High-resolution, scratch-resistant

Polyimide-based ink; Resolution ≥ 0.15 mm line width

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Number of Layers

Signal, power, ground, and inner layers

4–16 layers (flagship 5G phones: 12–16 layers)

Minimum Line Width/Spacing

Critical for high-density signal routing

30/30 μm (standard); 20/20 μm (high-end compact designs)

Via Specifications

Through-hole via, blind via, buried via

Blind/buried via diameter: 0.1–0.2 mm; Pad size: 0.2–0.3 mm

Pad Pitch

SMD pad spacing for fine-pitch components

0.3–0.5 mm (QFP/QFN); 0.2 mm (BGA); 0.1 mm (μBGA/CSP)

Impedance Control

Characteristic impedance for high-speed signals

50 Ω (RF signals); 90 Ω (USB 3.2/Type-C); 100 Ω (differential pairs: HDMI, DDR)

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Mounting Technology

SMT (Surface Mount Technology), THT (Through-Hole Technology), Mixed Assembly

SMT-dominant (≥95% components); THT for connectors/battery terminals

Component Size Compatibility

Support for miniaturized components

01005 (0.4×0.2 mm) passives; 0.2 mm pitch BGA; Flip-chip CSP

Placement Accuracy

Pick-and-place machine positioning precision

±0.03 mm (chip components); ±0.02 mm (BGA/QFN)

Reflow Soldering Profile

Temperature zones for lead-free solder

Preheat: 150–180°C; Peak temperature: 245–260°C; Dwell time: 30–60s

Dispensing Parameters

Solder paste/dispensing adhesive volume

Solder paste volume: 0.05–0.2 mg per pad; Adhesive dot diameter: 0.3–0.5 mm

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Insulation Resistance

Resistance between adjacent conductors

≥10¹⁰ Ω at 500 VDC

Dielectric Strength

Voltage withstand capability between layers

≥20 kV/mm (at 1 min AC test)

Current Carrying Capacity

Maximum current per copper trace

1 oz copper (35 μm): 1–3 A/mm width; 2 oz copper: 2–5 A/mm width

Signal Integrity

Insertion loss, return loss for high-speed signals

Insertion loss ≤ 1.5 dB @ 10 GHz; Return loss ≥ 15 dB @ 10 GHz

EMI/EMC Compliance

Electromagnetic interference suppression

Meets CE/FCC/CCC standards for mobile devices

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Thermal Cycle Test

Temperature cycling for durability

-40°C to +85°C; 500–1000 cycles; No solder cracking

Humidity Test

Damp heat reliability

85°C/85% RH; 1000 h; No corrosion or electrical failure

Vibration Test

Mechanical vibration resistance

10–2000 Hz; 1–3 g acceleration; 6–12 h per axis

Drop Test

Drop impact resistance

1.5 m drop onto concrete; 20 drops; No component detachment

Solder Joint Reliability

IPC-A-610 standard compliance

Class 3 (high-reliability) solder joint quality

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Board Dimensional Tolerance

Length/width variation

±0.1 mm for boards < 100 mm; ±0.2 mm for boards > 100 mm

Hole Position Tolerance

Via/pin hole placement accuracy

±0.05 mm (through-hole); ±0.03 mm (blind/buried via)

Warpage Tolerance

Post-assembly board flatness

≤ 0.75% (IPC-6012/2221 standard)